PCB certification

Pass qualification before you build

One run over your board returns a single readiness report: UL 796 construction, IPC-6012 class, coupon predictions, spacing and ampacity, each with a green, amber or red line and the one change that fixes it. Here it is on the ULX3S FPGA board.

Every via on the ULX3S, coloured by whether it keeps its Class 3 ring: amber ones need a wider pad. The chips switch each check on and off; tap a via or a marker for its numbers and its report line. Drag to pan, pinch or wheel to zoom.

5 of 7report lines pass as drawn

100%via ring retention, Class 2

9via structures predicted to pass the coupon tests

100%Class 3 ring retention after one pad change

ULX3S on JLCPCB meets the fab's UL-recognized construction (UL 796 design check).
ULX3S is IPC-6012 Class 2 ready (100% via ring retention under the fab's drill tolerance).

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The readiness report

  PassUL 796 construction
meets the fab's UL-recognized construction

  PassIPC-6012 Class 2
Class 2: 100% via ring retention under the fab drill tolerance

  One changeIPC-6012 Class 3
Class 3: 77.9% ring retention as drawn, 100% with the pad change
488 vias: drill 0.2 mm, pad 0.419 mm → Pad 0.419 to 0.55 mm
13 vias: drill 0.3 mm, pad 0.6 mm → Pad 0.6 to 0.65 mm
3 vias: drill 0.254 mm, pad 0.5 mm → Pad 0.5 to 0.604 mm
5 vias: drill 0.25 mm, pad 0.5 mm → Pad 0.5 to 0.6 mm
1 vias: drill 0.254 mm, pad 0.454 mm → Pad 0.454 to 0.604 mm

  PassCoupon predictions
9 via structures predicted to pass solder float, 6x reflow and IST; fewest IST cycles 1424 against 1000 required

  PassCreepage and clearance
+5V to GND: clearance 0.2 mm, 0.1 mm required

  PassTrace ampacity
vccio33 0.48 A: pass; core1v1 0.3 A: pass

  FailsVibration and drop
Steinberg: all 7 assessed parts within their allowable deflection, lowest margin 5.62x (U1); JESD22-B111 drop: U1 1927 microstrain over the 1500 microstrain limit
U1 (BGA) sees 1927 microstrain at the board surface in the condition B drop, over the 1500 microstrain limit

  Not assessedSolder joint fatigue
Not assessed: no cycles-to-failure is given for any part. This report has no solder-joint life model and no sourced package or laminate CTE to run one on, and it does not invent them

  

One change to Class 3

100% Class 3 with one change

Widen the pads on 510 of the 554 vias (table below). Flip the board between how it is drawn and with the change: the 510 amber rings go green. Tap any via for its numbers.

keeps its ringwiden this padGold: pads, blue: top copper

With the change, all 554 vias keep their ring: 100% Class 3 retention. Tap any via.

Where the drill lands on a Ø0.2 mm via

400 simulated drill hits on one of the 488 Ø0.2/0.419 vias, with the fab's ±0.075 mm drill and ±0.05/0.075 mm layer registration. A hit that reaches into the shaded band has lost its 0.05 mm Class 3 ring: 102 as drawn, 0 with the wider pad.

How much ring every via keeps

Smallest annular ring over the simulated drill hits, weighted to all 554 vias. As drawn, part of the amber distribution sits left of the Class 3 line; with the change all of the green sits to its right.

Vias	Drill	Pad today	Pad for Class 3	Keep ring now	After
488	0.2 mm	0.419 mm	0.55 mm	75.2%	100%
13	0.3 mm	0.6 mm	0.65 mm	99.5%	100%
5	0.25 mm	0.5 mm	0.6 mm	91.3%	100%
3	0.254 mm	0.5 mm	0.604 mm	91.3%	100%
1	0.254 mm	0.454 mm	0.604 mm	60%	100%

Every via structure survives the coupon tests

Predicted interconnect stress test (IST) life for each via structure on the board, against the 1000 cycles Class 3 qualification asks for. All 9 also pass solder float and six reflows.

The weakest structure is the Ø0.2 mm via with a 0.419 mm pad, 488 of them on the board: 1424 cycles against 1000. Open it to see the plated barrel in cross-section at the 260 °C reflow peak, coloured by stress, with the barrel knee where the pad meets the hole one tap away.